The problem of blistering after electroplating of zinc alloy die-casting products

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The problem of blistering after electroplating of zinc alloy die-casting products

Introduction
The electroplating process is a widely used method to enhance the appearance, corrosion resistance, and overall quality of zinc alloy die-casting products. However, one common problem that manufacturers encounter during this process is blistering. Blistering occurs when bubbles or blisters form on the surface of the electroplated product, diminishing its aesthetic appeal and potentially compromising its functionality. In this article, we will explore the causes of blistering and discuss strategies to prevent and address this issue.

Causes of Blistering
1. Surface Contaminants: One of the primary causes of blistering is the presence of surface contaminants on the zinc alloy die-casting products before electroplating. These contaminants can include dirt, oils, or residues from the casting process. When these contaminants are not adequately removed, they can become trapped under the plating layer, leading to blister formation.

2. Hydrogen Embrittlement: Hydrogen embrittlement is another significant factor contributing to blistering. During the electroplating process, hydrogen ions are released and can penetrate the zinc alloy substrate. When hydrogen accumulates within the metal, it can cause internal pressure to build up, leading to blister formation on the surface.

3. Inadequate Pretreatment: Proper pretreatment of the die-casting product is crucial before electroplating. Inadequate cleaning and surface preparation can leave imperfections that become blistering sites during plating.

Prevention and Remediation

1. Thorough Cleaning and Pretreatment: To prevent blistering, it is essential to thoroughly clean and prepare the surface of the zinc alloy die-casting product. This involves a multi-step process, including degreasing, pickling, and activation. These steps remove contaminants, ensure good adhesion of the plating layer, and reduce the risk of hydrogen embrittlement.

2. Proper Plating Conditions: Monitoring and controlling plating conditions are vital for preventing blistering. Parameters such as temperature, current density, and plating time should be optimized to minimize the risk of hydrogen accumulation. Reducing the plating time and temperature can help in this regard.

3. Proper Post-Plating Procedures: After electroplating, it is essential to subject the product to appropriate post-plating procedures. These may include baking the product in an oven to drive out any trapped hydrogen. This step helps to mitigate the risk of blistering and improve adhesion.

4. Quality Control and Inspection: Regular quality control and inspection processes should be in place to detect any early signs of blistering. This allows for prompt corrective action and can save time and resources in the long run.

Conclusion
Blistering after electroplating zinc alloy die-casting products can be a frustrating and costly problem for manufacturers. However, with a comprehensive understanding of its causes and appropriate preventive measures, blistering can be effectively managed. Our company is well-equipped to produce a wide range of electroplated products, and we employ these best practices to ensure that our products are of the highest quality, meeting both aesthetic and functional requirements. Thorough cleaning, proper plating conditions, and vigilant quality control are key elements in addressing this issue and ensuring customer satisfaction.

If you have precision cnc machining and die casting parts for the semiconductor, medical and optical field, please send the drawing inquiry to us for further evaluation:sales820@xy-global.com