Motorised hollow rotary platforms
OTHER configuration:
Material: aluminium alloy + steel
Bearings: Crossed tapered roller bearings
Process: Milling – Anodizing – Deburring
Annual volume: 500-1000PCS
Features: Tolerance 0.006mm
Processing difficulties: Through-hole burrs are not easy to remove
Process Chamber
OTHER configuration:
| Chamber Materials | The materials used to construct the chamber, i.e., stainless steel, may be preferable due to its high resistance to corrosion. |
| Size | A larger chamber may be needed for accommodating larger substrates or creating multi-chamber systems. |
| Pumping Speed | The pumping speed should match the expected outgassing rates of the system. Turbo pumps or oil-free pumps may be preferred depending on requirements. |
| Ultimate Pressure Requirements | This will depend on the required level of precision for the particular process being conducted; keeping low levels of residual gas is imperative where necessary. |
| Process Gas Compatibility | Some materials react with certain gases in ways that may not support effective processing and achieving desirable results. Compatibility must therefore be determined. |
Semiconductor equipment bases
OTHER configuration:
Material: SUS316
Process: Wire cutting, Milling ，Double side grinding, Lettering
Annual volume: 6000 PCS
Features: 0.5 small cutter processing, intersection hole burr not easy to remove
Semiconductor equipment connectors
OTHER configuration:
Material: SUS304/316
Process: turning-milling-polishing deburring
Annual volume: 400,000-600,000 PCS
Features: the material is not easy to cut, cross-hole burr is not easy to remove, high appearance requirements
Semiconductor equipment connectors
OTHER configuration:
Material: SUS304/316
Process: turning-milling-polishing deburring
Annual volume: 400,000-600,000 PCS
Features: the material is not easy to cut, cross-hole burr is not easy to remove, high appearance requirements
Semiconductor equipment parts
OTHER configuration:
Material: SUS304
Process: Milling -Surface grinding
Annual volume: 1000-2000PCS
Processing difficulties: flatness 0.01, cross hole burr removal
Semiconductor equipment platens
OTHER configuration:
Material: SUS304
Process: milling – grinding and polishing
Annual volume: 2000-3000PCS
Processing difficulties: thin structure of the workpiece is easy to deformation, parallelism 0.01
Semiconductor equipment support frame
OTHER configuration:
Material: SUS304/316
Process: turning-milling-polishing deburring
Annual volume: 400,000-600,000 PCS
Features: the material is not easy to cut, cross-hole burr is not easy to remove, high appearance requirements
Semiconductor valve block
OTHER configuration:
Material: 6061-T6
Process: Milling – Anodizing – Deburring – Laser engraving
Annual volume: 500-1000PCS
Features: Tolerance 0.006mm
Processing difficulties: Through-hole burrs are not easy to remove
vacuum chamber
OTHER configuration:
| Chamber Materials | The materials used to construct the chamber, i.e., stainless steel, may be preferable due to its high resistance to corrosion. |
| Size | A larger chamber may be needed for accommodating larger substrates or creating multi-chamber systems. |
| Pumping Speed | The pumping speed should match the expected outgassing rates of the system. Turbo pumps or oil-free pumps may be preferred depending on requirements. |
| Ultimate Pressure Requirements | This will depend on the required level of precision for the particular process being conducted; keeping low levels of residual gas is imperative where necessary. |
| Process Gas Compatibility | Some materials react with certain gases in ways that may not support effective processing and achieving desirable results. Compatibility must therefore be determined. |
