Semiconductor parts
Semiconductor equipment bases
OTHER configuration:
Material: SUS316
Process: Wire cutting, Milling ,Double side grinding, Lettering
Annual volume: 6000 PCS
Features: 0.5 small cutter processing, intersection hole burr not easy to remove
Product Description
product size chart or static pressure:
![](https://www.xy-global.com/wp-content/uploads/2024/04/734938b86b0120966184c8d2fa38e2f4.jpg)