Semiconductor parts
Semiconductor equipment platens
OTHER configuration:
Material: SUS304
Process: milling – grinding and polishing
Annual volume: 2000-3000PCS
Processing difficulties: thin structure of the workpiece is easy to deformation, parallelism 0.01
Product Description
product size chart or static pressure:
![](https://www.xy-global.com/wp-content/uploads/2024/04/734938b86b0120966184c8d2fa38e2f4.jpg)