Semiconductor valve block
OTHER configuration:
Material: 6061-T6
Process: Milling – Anodizing – Deburring – Laser engraving
Annual volume: 500-1000PCS
Features: Tolerance 0.006mm
Processing difficulties: Through-hole burrs are not easy to remove
Semiconductor equipment connectors
OTHER configuration:
Material: SUS304/316
Process: turning-milling-polishing deburring
Annual volume: 400,000-600,000 PCS
Features: the material is not easy to cut, cross-hole burr is not easy to remove, high appearance requirements
Semiconductor equipment connectors
OTHER configuration:
Material: SUS304/316
Process: turning-milling-polishing deburring
Annual volume: 400,000-600,000 PCS
Features: the material is not easy to cut, cross-hole burr is not easy to remove, high appearance requirements
Semiconductor equipment platens
OTHER configuration:
Material: SUS304
Process: milling – grinding and polishing
Annual volume: 2000-3000PCS
Processing difficulties: thin structure of the workpiece is easy to deformation, parallelism 0.01
Semiconductor equipment parts
OTHER configuration:
Material: SUS304
Process: Milling -Surface grinding
Annual volume: 1000-2000PCS
Processing difficulties: flatness 0.01, cross hole burr removal
Semiconductor equipment bases
OTHER configuration:
Material: SUS316
Process: Wire cutting, Milling ，Double side grinding, Lettering
Annual volume: 6000 PCS
Features: 0.5 small cutter processing, intersection hole burr not easy to remove
Motorised hollow rotary platforms
OTHER configuration:
Material: aluminium alloy + steel
Bearings: Crossed tapered roller bearings
Process: Milling – Anodizing – Deburring
Annual volume: 500-1000PCS
Features: Tolerance 0.006mm
Processing difficulties: Through-hole burrs are not easy to remove
Semiconductor equipment support frame
OTHER configuration:
Material: SUS304/316
Process: turning-milling-polishing deburring
Annual volume: 400,000-600,000 PCS
Features: the material is not easy to cut, cross-hole burr is not easy to remove, high appearance requirements
Process Chamber
OTHER configuration:
- Chamber Materials:
- Prefer stainless steel for corrosion resistance.
- Size:
- Larger chambers for bigger substrates or multi-chamber setups.
- Pumping Speed:
- Match speed to outgassing; consider turbo or oil-free pumps.
- Ultimate Pressure:
- Ensure low residual gas for high precision.
- Gas Compatibility:
- Verify material and gas compatibility to avoid adverse reactions.
vacuum chamber
OTHER configuration:
- Chamber Materials:
- Stainless steel is preferred for its corrosion resistance.
- Size:
- Larger chambers may be required for bigger substrates or multi-chamber systems.
- Pumping Speed:
- Align speed with outgassing rates; consider turbo or oil-free pumps as needed.
- Ultimate Pressure:
- Precision processes require low residual gas levels.
- Process Gas Compatibility:
- Ensure materials are compatible with process gases to avoid adverse reactions.
